Four thematic sessions on topics of intense research interest are:
- 3D stacking for next-generation logic and memory using wafer bonding and related technologies
- Logic, package and system technologies for future generative AI
- Neuromorphic computing for smart sensors
- Sustainability in semiconductor device technology and manufacturing
The technical program will include more than 225 presentations as well as a full lineup of panels, discussion sessions, tutorials, short courses, a career luncheon, a vendor expo and IEEE awards presentations /EDS.
“IEDM offers valuable insight into where the industry is headed, as the cutting-edge work presented at the conference highlights key trends and paradigm shifts in key semiconductor technologies,” said Jungwoo Joh, IEDM 2023 Publicity Chair and Process Development Manager at Texas Instruments. . “For example, this year there are many articles discussing ways to stack devices in 3D configurations. This is of course nothing new, but two things are particularly notable about this work. The first is that this not only happens with conventional logic and memory devices, but also with sensors, power devices, neuromorphic devices and others. Additionally, many articles do not describe futuristic laboratory studies, but rather specific hardware demonstrations that generated robust results, paving the way for commercial feasibility.
“Finding the right materials and device configurations to develop transistors that will perform well with acceptable reliability levels remains a major challenge,” said Kang-ill Seo, IEDM 2023 publicity vice president and vice president of semiconductor R&D at Samsung Semiconductor. “This year’s program shows that electrothermal considerations remain in focus, particularly with attempts to add functionality to the interconnect or wiring of a chip, which is manufactured using low-cost processes. temperature.”
Here are the details of the 2023 IEEE International Meeting on Electronic Devices:
Tutorial sessions – Saturday December 9
Saturday tutorial sessions on emerging technologies are presented by experts in the field to bridge the gap between textbook-level knowledge and current cutting-edge research, and to introduce participants to new areas of interest. There are three time slots, each with two tutorials running in parallel:
1:30 p.m. – 2:50 p.m.
- Innovative technology for beyond 2nmMatthieu Metz, Intel
- CMOS+X: functional augmentation of CMOS for next generation electronicsSayeef Salahuddin, UC-Berkeley
3:05 p.m. – 4:25 p.m.
- Reliability Challenges of Emerging FET DevicesJacopo Franco, Imec
- Advanced packaging and heterogeneous integration – Past, present and futureMadhavan Swaminathan, Penn State
4:40 p.m. – 6:00 p.m.
- Synapses, circuits, and architectures for hardware acceleration of deep neural network inference based on in-memory analog computationIrem Boybat, IBM
- Device Modeling Tools: From SPICE to Scientific Machine LearningKeno Fischer, JuliaHub
Short course – Sunday December 10
Unlike tutorials, full-day short courses focus on a single technical topic. They provide the opportunity to learn about important areas and developments and network with global experts.
- Transistor, interconnect, and chipsets for next-generation low-power, high-performance computing, curated by Yuri Y. Masuoka, Samsung
- Advanced Technology Requirements for Edge ComputingJie Deng, Qualcomm
- Process technology towards 1nm and beyondTomonari Yamamoto, Tokyo Electron
- Empowering Platform Technology with Future Semiconductor Device InnovationJaehun Jeong, Samsung
- Future energy delivery process architectures, their capabilities and their impact on interconnection scalingKevin Fischer, Intel
- DTCO/STCO in the era of vertical integrationYK Chong, ARM
- Low Power SOC Design Trends/3D Integration/Mobile App PackagingMilind Shah, Google
- The Future of Memory Technologies for High Performance Memory and Computing, Curated by Ki Il Moon, SK Hynix
- High-density, high-performance technologies for future memoryKoji Sakui, Unisantis Electronics Singapore/Tokyo Institute of Technology
- Advanced packaging solutions for high-performance memory and computingJaesik Lee, Saskatchewan Hynix
- In-Memory Analog Computing for Deep Learning InferenceAbou Sébastien, IBM
- The Next Generation of AI Architectures: The Role of Advanced Packaging Technologies in Creating Heterogeneous ChipsetsRaja Swaminathan, AMD
- Key challenges and direction of memory technology for AI and high-performance computingKeith Kim, NVIDIA
- Charge-trap memories: from fundamental device physics to 3D memory architectures (3D NAND, 3D NOR, 3D DRAM) and in-memory computing (CIM)Hang-Ting (Oliver) Read, Macronix
Plenary presentations – Monday December 11
- Redefining Innovation: A Journey Forward into the Next Dimension EraSiyoung Choi, President and CEO, Samsung Foundry Business, Device Solutions Division
- The Next Big Break: Creating Magic in Memory and Economics Beyond Moore’s LawThy Tran, vice president of global front-end procurement, Micron
- Semiconductor Challenges in 5G and 6G Technology PlatformsBjörn Ekelund, Director of Corporate Research, Ericsson
Evening debate session – Tuesday evening, December 12
The MEI Evening Roundtable is an interactive forum where experts provide their perspectives on important industry topics, and audience participation is encouraged to foster an open exchange of ideas. This year’s panel will be moderated by Dan Hutcheson, Vice President of Tech Insights.
- AI: semiconductor catalyst? Or disruptive? Artificial intelligence (AI) has long been a hot topic. In 2023, things got heated when large language models became easily accessible to the public. This year’s MEI will not rehash what has been reported by the media. Instead, it will bring together industry experts to discuss how AI is changing the semiconductor industry and ask them how they are using AI to transform their efforts. Topics will range widely, from how AI will drive demand for semiconductors to how it will change design and manufacturing, and even how it will change the jobs and careers of those who work there. working.
Lunch – Tuesday December 12
There will be a career-focused luncheon featuring industry leaders and scientists who will speak about their personal experiences in the context of career development. The discussion will be moderated by Jennifer Zhao,
President/CEO, asm OSRAM USA Inc. Speakers will be:
- Ilesanmi Adesida, University Dean and Acting President of Nazarbayev University, Kazakhstan — Professor Ilesanmi Adesida is an experienced scientist/engineer and administrator in scientific and educational circles, with over 350 peer-reviewed articles/ 250 presentations at international conferences.
- Isabelle Ferain, Vice President of Technology Development, GlobalFoundries — Dr. Ferain oversees GF’s technology development mission across its 300mm manufacturing plants in the United States and Europe.
Vendor Expo/MRAM Poster Session/Global MRAM Innovation Forum
- A vendor exhibition will again be organized.
- A special poster session dedicated to MRAM (magneto-resistive RAM) will take place at IEDM on Tuesday, December 12 from 2:20 p.m. to 5:30 p.m., sponsored by the IEEE Magnetics Society.
- Also sponsored by the IEEE Magnetics Society, the 15th Global MRAM Innovation Forum will be held at the same location following the conclusion of the IEDM conference on Thursday, December 14.
For registration and other information, visit www.ieee-iedm.org.